Using silica nanoparticles as curing reagents for epoxy resins to form epoxy-silica nanocomposites

被引：35

作者：

Liu, YL ^{[1
]}

Li, SH

机构：

[1] Chung Yuan Christian Univ, Dept Chem Engn, Taoyuan 320, Taiwan

[2] Chung Yuan Christian Univ, R&D Ctr Membrance Technol, Taoyuan 320, Taiwan

来源：

JOURNAL OF APPLIED POLYMER SCIENCE | 2005年 / 95卷 / 05期

关键词：

curing of polymers; epoxy; nanocomposites; silicas; nanoparticles;

D O I：

10.1002/app.21327

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

Nanoscale colloidal silica showed high reactivity toward curing epoxy resins to form epoxy-silica nanocomposites under mild conditions. Adding a certain amount (5000 ppm) of magnesium chloride lowered the activation energy of the reaction from 71. to 46 kJ/mol. Less and more magnesium chloride both exhibited counter action on lowering the activation energy of the curing reaction. Tin chloride dihydrate and zinc acetylacetonate hydrate were also added into the curing compositions, however, showing no significant effect on promoting the curing reaction. Through this curing reaction, epoxy-silica nanocomposites containing high silica contents up to 70 wt % were obtained. Therefore, this reaction provided a novel and convenient route in preparation of epoxy-silica nanocomposites. (C) 2005 Wiley Periodicals, Inc.

引用

页码：1237 / 1245

页数：9

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