Microfabrication using silicon mold inserts and hot embossing

We have successfully demonstrated the feasibility of fabricating three-dimensional microstructures by using a combined silicon mold insert and micro hot embossing process (SMIHE). Anisotropic silicon wet etching process has been used to define microstructures on top of a four inch silicon wafer. The whole wafer is then used as the mold insert in a micro hot pressing machine to duplicate plastic microstructures repeatedly. Fine micro pyramid shape microstructures with base width of 30 mu m and height of about 21 mu m have been fabricated by this method as a demonstration. They have very smooth surfaces and may be suitable for optical applications. This new process shows promise for achieving high yield, reliable fine micro structures on plastic films.