Tungsten Oxide Resistive Memory Using Rapid Thermal Oxidation of Tungsten Plugs

被引:20
作者
Lai, Erh-Kun [1 ,2 ]
Chien, Wei-Chih [1 ,3 ]
Chen, Yi-Chou [1 ]
Hong, Tian-Jue [1 ]
Lin, Yu-Yu [1 ]
Chang, Kuo-Pin [1 ]
Yao, Yeong-Der [4 ,5 ]
Lin, Pang [3 ]
Horng, Sheng-Fu [2 ]
Gong, Jeng [2 ]
Tsai, Shih-Chang [1 ]
Lee, Ching-Hsiung [1 ]
Hsieh, Sheng-Hui [1 ]
Chen, Chun-Fu [1 ]
Shih, Yen-Hao [1 ]
Hsieh, Kuang-Yeu [1 ]
Liu, Rich [1 ]
Lu, Chih-Yuan [1 ]
机构
[1] Macronix Int Co Ltd, Hsinchu 300, Taiwan
[2] Natl Tsing Hua Univ, Inst Elect Engn, Hsinchu 300, Taiwan
[3] Natl Chiao Tung Univ, Dept Mat Sci & Engn, Hsinchu 300, Taiwan
[4] Fu Jen Catholic Univ, Dept Phys, Taipei 242, Taiwan
[5] Fu Jen Catholic Univ, Inst Appl Sci & Engn, Taipei 242, Taiwan
关键词
Metals - Rapid thermal annealing - Tungsten compounds - Nonvolatile storage - Thermooxidation - MOS devices - Rapid thermal processing - CMOS integrated circuits;
D O I
10.1143/JJAP.49.04DD17
中图分类号
O59 [应用物理学];
学科分类号
摘要
A complementary metal oxide semiconductor (CMOS)-compatible WOx based resistive memory has been developed. The WOx memory layer is made from rapid thermal oxidation of W plugs. The device performs excellent electrical properties. The switching speed is extremely fast (similar to 2 ns) and the programming voltage (< 1: 4 V) is low. For single-level cell (SLC) operation, the device shows a large resistance window, and 10(8)-cycle endurance. For multi-level cell (MLC) operation, it demonstrates 2-bit/cell storage with the endurance up to 10000 times. The rapid thermal oxidation (RTO) WOx resistance random access memory (RRAM) is very promising for both high-density and embedded memory applications. (C) 2010 The Japan Society of Applied Physics
引用
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页数:4
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