A contactless method for the directed formation of submicrometer copper wires

被引：23

作者：

Bradley, JC ^{[1
]}

Crawford, J ^{[1
]}

McGee, M ^{[1
]}

Stephens, SG ^{[1
]}

机构：

[1] Drexel Univ, Dept Chem, Philadelphia, PA 19104 USA

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1998年 / 145卷 / 03期

关键词：

D O I：

10.1149/1.1838336

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

We report the growth of the submicrometer wires onto copper particles a few micrometers in diameter without the use of photolithography, templates, or physical contact to an external circuit. The wires were grown by a spatially coupled electrodissolution and electrode-position mechanism directed by the action of an electric field. Scanning electron micrographs of the wires indicate that they are composed of ropelike deposits as small as 0.3 mu m in diameter. The ability to form such miniature structures at a predictable location on the particle surface relies on the toposelective (site-selective) interaction of the electric field with the particles. These results may point to a novel method for constructing submicrometer electronic devices.

引用

页码：L45 / L47

页数：3

共 30 条

[1] SELF-SIMILARITY OF DIFFUSION-LIMITED AGGREGATES AND ELECTRODEPOSITION CLUSTERS [J].