Intermetallic morphology and damage evolution under thermomechanical fatigue of lead (Pb)-free solder interconnections

被引：41

作者：

Dunford, S ^{[1
]}

Canumalla, S ^{[1
]}

Viswanadham, P ^{[1
]}

机构：

[1] Nokia, Irving, TX 75039 USA

来源：

54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS | 2004年

关键词：

D O I：

10.1109/ECTC.2004.1319418

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The variety and complexity of intermetallic morphologies are highlighted in this paper along with their role in defining failure under thermal fatigue. Some of the failure mechanisms for Sn3.8Ag0.7Cu and Sn3.5Ag solder on organic solderability preservative (OSP) and electroless Ni immersion Au (ENIG) pad surface finishes are discussed. Interrupted fatigue test results were used to document the location and progression of damage.

引用

页码：726 / 736

页数：11

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