Mode-dependent toughness and the delamination of compressed thin films

被引:30
作者
Audoly, B [1 ]
机构
[1] Ecole Normale Super, Phys Stat Lab, CNRS, F-75231 Paris 05, France
关键词
delamination; plates; stability and bifurcations; friction;
D O I
10.1016/S0022-5096(00)00007-7
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
We consider the buckle-driven delamination of compressed thin films. For a wide class of patterns of delamination, it is shown that the loading on the delamination front progressively goes from mode I to mode II during growth of the blister. As a result, the mode dependence of the film/substrate interface excludes widespread delamination. This explains the observations of blisters of finite extent, which are otherwise difficult to interpret. We also study a model of interfacial fracture with friction. It reveals that a severe mode dependence can be induced by interfacial friction. This permits us to account for the mode dependence using only simple ingredients: friction and linear elasticity. (C) 2000 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:2315 / 2332
页数:18
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