Nanomechanical optical devices fabricated with aligned wafer bonding

被引：5

作者：

Gui, C ^{[1
]}

Veldhuis, GJ ^{[1
]}

Koster, TM ^{[1
]}

Lambeck, PV ^{[1
]}

Berenschot, JW ^{[1
]}

Gardeniers, JGE ^{[1
]}

Elwenspoek, M ^{[1
]}

机构：

[1] Univ Twente, MESA Res Inst, Enschede, Netherlands

来源：

MICRO ELECTRO MECHANICAL SYSTEMS - IEEE ELEVENTH ANNUAL INTERNATIONAL WORKSHOP PROCEEDINGS | 1998年

关键词：

D O I：

10.1109/MEMSYS.1998.659805

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

This paper reports on a new method for making some types of integrated optical nanomechanical devices. Intensity modulators as well as phase modulators were fabricated using several silicon micromachining techniques, including chemical mechanical polishing and aligned wafer bonding. This new method enables batch fabrication of the nanomechanical optical devices, and enhances their performance.

引用

页码：482 / 487

页数：2