Wafer-level packaging technology for MEMS

被引：9

作者：

Mirza, AR ^{[1
]}

机构：

[1] Elect Vis Inc, Phoenix, AZ 85034 USA

来源：

ITHERM 2000: SEVENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOL I, PROCEEDINGS | 2000年

关键词：

D O I：

10.1109/ITHERM.2000.866816

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

This paper reviews the essential MEMS (Microelectromechanical Systems) silicon wafer processes that are needed for wafer-level packaging. Precision aligned wafer bonding is the key enabling technology for high-volume, low cost packaging of MEMS devices. State-of-the-art aligned silicon wafer bonding can provide not only basic MEMS device functionality, but also first-level assembly or packaging solutions for many MEMS devices. Numerous examples of high-volume production applications for wafer-level bonding will be described.

引用

页码：113 / 119

页数：7

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