X- and Ku-band amplifiers based on Si/SiGe HBT's and micromachined lumped components

被引:42
作者
Rieh, JS [1 ]
Lu, LH
Katehi, PB
Bhattacharya, P
Croke, ET
Ponchak, GE
Alterovitz, SA
机构
[1] Univ Michigan, Dept Elect Engn & Comp Sci, Ann Arbor, MI 48109 USA
[2] Hughes Res Labs, Malibu, CA 90265 USA
[3] NASA, Lewis Res Ctr, Cleveland, OH 44135 USA
关键词
amplifier; HBT; micromachining; MMIC; resonance frequency; SiGe;
D O I
10.1109/22.668683
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A double mesa-structure Si/SiGe heterojunction bipolar transistor (HBT) and novel micromachined lumped passive components have been developed and successfully applied to the fabrication of X- and Ku-band monolithic amplifiers. The fabricated 5 x 5 mu m(2) emitter-size Si/SiGe HBT exhibited a de-current gain beta of 109, and f(T) and f(max) of 28 and 52 GHz, respectively. Micromachined spiral inductors demonstrated resonance frequency of 20 GHz up to 4 nH, which is higher than that of conventional spiral inductors by a factor of two. Single-, dual-, and three-stage S-band amplifiers have been designed, based on the extracted active-and passive-device model parameters. A single-stage amplifier exhibited a peak gain of 4.0 dB at 10.0 GHz, while dual-and three-stage versions showed peak gains of 5.7 dB at 10.0 GHz and 12.6 dB at 11.1 GHz, respectively, A Ku-band single-stage amplifier has also been designed and fabricated, showing a peak gain of 1.4 dB at 16.6 GHz, Matching circuits for all these amplifiers were implemented by lumped components, leading to a much smaller chip size compared to those employing distributed components as matching elements.
引用
收藏
页码:685 / 694
页数:10
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