Effect of heating time below the melting temperature on polyphenylene sulfide adhesive joint development

被引：30

作者：

Mei, Z ^{[1
]}

Chung, DDL ^{[1
]}

机构：

[1] SUNY Buffalo, Dept Mech & Aerosp Engn, Composite Mat Res Lab, Buffalo, NY 14260 USA

来源：

INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES | 2000年 / 20卷 / 04期

关键词：

polyphenylene sulfide; PPS; adhesion; joint; electrical resistance; carbon fiber; calorimetry;

D O I：

10.1016/S0143-7496(99)00056-1

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

A long heating time below the melting temperature (T-m) was found to be detrimental to subsequent polyphenylene sulfide (PPS) adhesive joint development above T-m. This was found to be due to curing reactions below T-m and consequent reduced mass flow response above T-m. A high heating rate (small heating time) enhanced the bonding more than a high pressure. The study was conducted by measurement of the contact electrical resistance of the joint, and was supported by calorimetry. (C) 2000 Elsevier Science Ltd. All rights reserved.

引用

页码：273 / 277

页数：5

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