Three-dimensional high-frequency distribution networks - Part II: Packaging and integration

被引：17

作者：

Henderson, RM

Herrick, KJ

Weller, TM

Robertson, SV

Kihm, RT

Katehi, LPB

机构：

[1] Univ Michigan, Dept Elect Engn & Comp Sci, Ann Arbor, MI 48109 USA

[2] Univ S Florida, Dept Elect Engn, Tampa, FL 33620 USA

[3] Raytheon Co, Microwave Ctr, Elect Syst, El Segundo, CA 90245 USA

来源：

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2000年 / 48卷 / 10期

关键词：

coplanar transmission lines; micromachining; microwave circuits;

D O I：

10.1109/22.873891

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper describes the implementation and packaging of the components, described in Part I of this paper, to realize a three-dimensional W-band distribution network.

引用

页码：1643 / 1651

页数：9

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