Atomic layer deposition of ZrO2 on W for metal-insulator-metal capacitor application

被引:130
作者
Lee, SY
Kim, H [1 ]
McIntyre, PC
Saraswat, KC
Byun, JS
机构
[1] Stanford Univ, Dept Mat Sci & Engn, Stanford, CA 94305 USA
[2] Stanford Univ, Dept Elect Engn, Stanford, CA 94305 USA
[3] Appl Mat Inc, Santa Clara, CA 95054 USA
关键词
D O I
10.1063/1.1569985
中图分类号
O59 [应用物理学];
学科分类号
摘要
A metal-insulator-metal (MIM) capacitor using ZrO2 on tungsten (W) metal bottom electrode was demonstrated and characterized in this letter. Both ZrO2 and W metal were synthesized by an atomic layer deposition (ALD) method. High-quality 110similar to115 Angstrom ZrO2 films were grown uniformly on ALD W using ZrCl4 and H2O precursors at 300 degreesC, and polycrystalline ZrO2 in the ALD regime could be obtained. A 13similar to14-Angstrom-thick interfacial layer between ZrO2 and W was observed after fabrication, and it was identified as WOx through angle-resolved x-ray photoelectron spectroscopy analysis with wet chemical etching. The apparent equivalent oxide thickness was 20similar to21 Angstrom. An effective dielectric constant of 22similar to25 including an interfacial WOx layer was obtained by measuring capacitance and thickness of MIM capacitors with Pt top electrodes. High capacitance per area (16similar to17 fF/mum(2)) and low leakage current (10(-7) A/cm(2) at +/-1 V) were achieved. (C) 2003 American Institute of Physics.
引用
收藏
页码:2874 / 2876
页数:3
相关论文
共 13 条
[1]   CONDENSED PHASE RELATIONS IN SYSTEMS ZRO2-WO2-WO3 AND HFO2-WO2-WO3 [J].
CHANG, LLY ;
SCROGER, MG ;
PHILLIPS, B .
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1967, 50 (04) :211-&
[2]   Structure and stability of ultrathin zirconium oxide layers on Si(001) [J].
Copel, M ;
Gribelyuk, M ;
Gusev, E .
APPLIED PHYSICS LETTERS, 2000, 76 (04) :436-438
[3]   Comparison of dielectric characteristics of Ta2O5 thin films on RuO2 and Ru bottom electrodes [J].
Huang, JH ;
Lai, YS ;
Chen, JS .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2001, 148 (07) :F133-F136
[4]   DEPOSITION OF EXTREMELY THIN (BA,SR)TIO3 THIN-FILMS FOR ULTRA-LARGE-SCALE INTEGRATED DYNAMIC RANDOM-ACCESS MEMORY APPLICATION [J].
HWANG, CS ;
PARK, SO ;
CHO, HJ ;
KANG, CS ;
KANG, HK ;
LEE, SI ;
LEE, MY .
APPLIED PHYSICS LETTERS, 1995, 67 (19) :2819-2821
[5]   Atomic layer deposition of tungsten using sequential surface chemistry with a sacrificial stripping reaction [J].
Klaus, JW ;
Ferro, SJ ;
George, SM .
THIN SOLID FILMS, 2000, 360 (1-2) :145-153
[6]   Leakage current mechanism of metal-Ta2O5-metal capacitors for memory device applications [J].
Lai, BCM ;
Lee, JYM .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1999, 146 (01) :266-269
[7]   Novel MIS Al2O3 capacitor as a prospective technology for Gbit DRAMs [J].
Park, IS ;
Lee, BT ;
Choi, SJ ;
Im, JS ;
Lee, SH ;
Park, KY ;
Lee, JW ;
Hyung, YW ;
Kim, YK ;
Park, HS ;
Park, YW ;
Lee, SI ;
Lee, MY .
2000 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS, 2000, :42-43
[8]   Electrical and materials properties of ZrO2 gate dielectrics grown by atomic layer chemical vapor deposition [J].
Perkins, CM ;
Triplett, BB ;
McIntyre, PC ;
Saraswat, KC ;
Haukka, S ;
Tuominen, M .
APPLIED PHYSICS LETTERS, 2001, 78 (16) :2357-2359
[9]   Atomic layer deposition of oxide thin films with metal alkoxides as oxygen sources [J].
Ritala, M ;
Kukli, K ;
Rahtu, A ;
Räisänen, PI ;
Leskelä, M ;
Sajavaara, T ;
Keinonen, J .
SCIENCE, 2000, 288 (5464) :319-321
[10]  
*SEM IND ASS, 2001, INT ROADM SEM