Grain boundary penetration of nickel by liquid bismuth as a film of nanometric thickness

被引：54

作者：

Marié, N ^{[1
]}

Wolski, K ^{[1
]}

Biscondi, M ^{[1
]}

机构：

[1] Ecole Natl Super Mines, CNRS URA 1884, Ctr SMS, F-42023 St Etienne 02, France

来源：

SCRIPTA MATERIALIA | 2000年 / 43卷 / 10期

关键词：

nickel; bismuth; Auger electron spectroscopy; liquid metal embrittlement; intergranular penetration;

D O I：

10.1016/S1359-6462(00)00518-2

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 [材料科学与工程]; 080502 [材料学];

摘要：

The depth of intergranular embrittlement was studied using Nisolid-Biliquid system as the sample. It was found that the contact between solid nickel and liquid Bi-Ni alloy at 700°C results in strong grain boundary penetration and consecutive room temperature embrittlement of nickel.

引用

页码：943 / 949

页数：7

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