Micromachined infrared bolometers on flexible polyimide substrates

被引:76
作者
Dayeh, SA [1 ]
Butler, DP [1 ]
Çelik-Butler, Z [1 ]
机构
[1] Univ Texas, Dept Elect Engn, Arlington, TX 76019 USA
基金
美国国家科学基金会;
关键词
microbolometers; flexible substrate; micromachining; yttrium barium copper oxide; MEMS; smart skin;
D O I
10.1016/j.sna.2004.07.009
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Micromachined infrared sensor arrays have been fabricated on flexible polyimide substrates using a silicon wafer carrier during the fabrication process. These flexible polyimide substrates containing the micromachined infrared sensors were removed from the silicon wafer at the end of fabrication. The fabrication technique utilized surface micromachining of a bridge structure to form the thermal infrared (IR) sensors on flexible substrates. Semiconducting yttrium barium copper oxide YBCO was used as the radiation sensitive material. I x 10 sensor arrays of microbolometers were micromachined using a photo-definable polyimide sacrificial layer and characterized before and after removal of the substrate from the Si wafer carrier. The flexible infrared microsensors showed similar performance to microbolometers fabricated on rigid silicon substrates. The YBCO thermistors exhibited a temperature coefficient of resistance (TCR) of similar to-3.4% K-1 near room temperature. Responsivity and detectivity values as high as 6.1 X 10(4) V/W and 1.2 x 10(8) cm Hz (1/2) /W, respectively, were measured in vacuum for a 40 mum x 40 mum microbolometer with 1 muA bias. The lowest observed noise equivalent power was 4.1 X 10(-11) W/Hz(1/2) while the lowest thermal time constant was 5.7 ms. (C) 2004 Elsevier B.V. All rights reserved.
引用
收藏
页码:49 / 56
页数:8
相关论文
共 27 条
[1]  
BANG C, 1996, AFOSR CONTR GRANT M
[2]   FLEXIBLE CIRCUIT AND SENSOR ARRAYS FABRICATED BY MONOLITHIC SILICON TECHNOLOGY [J].
BARTH, PW ;
BERNARD, SL ;
ANGELL, JB .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1985, 32 (07) :1202-1205
[3]   A FLEXIBLE POLYIMIDE-BASED PACKAGE FOR SILICON SENSORS [J].
BEEBE, DJ ;
DENTON, DD .
SENSORS AND ACTUATORS A-PHYSICAL, 1994, 44 (01) :57-64
[4]  
BOARINO L, 1998, 4 THERMINIC WORKSH 2
[5]   Uncooled micromachined bolometer arrays on flexible substrates [J].
Dayeh, SA ;
Butler, DP ;
Çelik-Butler, Z ;
Wisian-Neilson, P .
INFRARED TECHNOLOLGY AND APPLICATIONS XXIX, 2003, 5074 :537-547
[6]  
Dereniak E., 1996, INFRARED DETECTORS S
[7]   Development of polyimide flexible tactile sensor skin [J].
Engel, J ;
Chen, J ;
Liu, C .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2003, 13 (03) :359-366
[8]   Failure resistance of amorphous silicon transistors under extreme in-plane strain [J].
Gleskova, H ;
Wagner, S ;
Suo, Z .
APPLIED PHYSICS LETTERS, 1999, 75 (19) :3011-3013
[9]   Gold wire bonding onto flexible polymeric substrates [J].
Hall, E ;
Lyons, AM ;
Weld, JD .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1996, 19 (01) :12-17
[10]  
Hsu P. I., 2000, MAT RES SOC S P, V621