Optimum placement of decoupling capacitors on packages and printed circuit boards under the guidance of electromagnetic field simulation

被引：19

作者：

Chen, YH ^{[1
]}

Chen, ZQ ^{[1
]}

Fang, JY ^{[1
]}

机构：

[1] SUNY BINGHAMTON,DEPT ELECT ENGN,BINGHAMTON,NY 13901

来源：

46TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1996 PROCEEDINGS | 1996年

关键词：

D O I：

10.1109/ECTC.1996.550492

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper presents an efficient signal integrity analysis technique for simulating voltage fluctuations on power/ground planes in complex packaging structures. With its unique circuit and electromagnetic field solvers, the value, the number and the location of the decoupling capacitor placed on packages or printed circuit boards can be quickly and effectively evaluated. Examples are provided to demonstrate that how a good decoupling scheme is achieved under the guidance of electromagnetic field simulation.

引用

页码：756 / 760

页数：3