A new micro-tensile system for measuring the mechanical properties of low-dimensional materials - Fibers and films

被引:23
作者
Hua, Tao [1 ]
Xie, Huimin [1 ]
Pan, Bing [1 ]
Qing, Xinlin [1 ]
Dai, Fulong [1 ]
Feng, Xiqiao [1 ]
机构
[1] Tsinghua Univ, FML, Dept Mech Engn, Beijing 100084, Peoples R China
基金
中国国家自然科学基金;
关键词
low-dimensional materials; micro-tensile device; DIC; deformation;
D O I
10.1016/j.polymertesting.2007.01.008
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
A new micro-tensile system has been developed to evaluate the mechanical properties of low-dimensional materials, such as fibers and films. The proposed system uses a magnet-coil force actuator to apply a tensile load on the material and a digital image correlation (DIC) method to measure the corresponding displacement and strain of the material. The system combines a supporting frame, a hanging spring, a magnet-coil, a permanent magnet, two specimen clamps, an adjustable stage and an image acquisition unit. To verify the proposed technique, experiments were conducted on two polymeric materials, silkworm silk and polyethylene oxide film containing nano-composite SiO2 (15%), to demonstrate the effectiveness of the system. (C) 2007 Elsevier Ltd. All rights reserved.
引用
收藏
页码:513 / 518
页数:6
相关论文
共 12 条
[1]  
DING JN, 2000, CHINESE J SCI INSTRU, V21, P442
[2]   STRESS BIREFRINGENCE IN POLYPROPYLENE FIBERS [J].
HAMZA, AA ;
FOUDA, IM ;
ELFARHATY, KA ;
HELALY, SA .
POLYMER TESTING, 1987, 7 (05) :329-343
[3]  
Huo B, 2002, ACTA POLYM SIN, P261
[4]   Enhanced ionic conductivity of polymer electrolytes containing nanocomposite SiO2 particles -: art. no. 266104 [J].
Nan, CW ;
Fan, LZ ;
Lin, YH ;
Cai, Q .
PHYSICAL REVIEW LETTERS, 2003, 91 (26)
[5]   M-TEST: A test chip for MEMS material property measurement using electrostatically actuated test structures [J].
Osterberg, PM ;
Senturia, SD .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 1997, 6 (02) :107-118
[6]   Performance of sub-pixel registration algorithms in digital image correlation [J].
Pan, Bing ;
Xie, Hui-min ;
Xu, Bo-qin ;
Dai, Fu-long .
MEASUREMENT SCIENCE AND TECHNOLOGY, 2006, 17 (06) :1615-1621
[7]   DIGITAL IMAGING TECHNIQUES IN EXPERIMENTAL STRESS-ANALYSIS [J].
PETERS, WH ;
RANSON, WF .
OPTICAL ENGINEERING, 1982, 21 (03) :427-431
[8]  
Read DT, 1998, J TEST EVAL, V26, P255, DOI 10.1520/JTE11999J
[9]   A new technique for measuring the mechanical properties of thin films [J].
Sharpe, WN ;
Yuan, B ;
Edwards, RL .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 1997, 6 (03) :193-199
[10]   Investigation of effect of temperature and strain rate on mechanical properties of underfill material by use of microtensile specimens [J].
Shi, XQ ;
Wang, ZP ;
Pang, HLJ ;
Zhang, XR .
POLYMER TESTING, 2002, 21 (06) :725-733