Suppression of stiction in MEMS

被引：21

作者：

Mastrangelo, CH ^{[1
]}

机构：

[1] Univ Michigan, Dept Elect Engn & Comp Sci, Ctr Integrated Microsyst, Ann Arbor, MI 48109 USA

来源：

MATERIALS SCIENCE OF MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES II | 2000年 / 605卷

关键词：

D O I：

10.1557/PROC-605-105

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Stiction failures in microelectromechanical systems (MEMS) occur when suspended elastic members are unexpectedly pinned to their substrates. This type of device failure develops both in fabrication and during device operation, being a dominant source of yield loss in MEMS. Stiction failures require first a collapse force that brings the elastic member contact with the substrate followed by an intersolid adhesion sufficiently large to overcome the elastic restoring force. Stiction failure mechanisms have been studied extensively elsewhere [1]. This paper briefly summarizes these mechanisms in a the practical way. Over the last decade. stiction failure rates in MEMS have been minimized using a wide variety of processing, surface treatment, and physical schemes. An update of these methods is provided.

引用

页码：105 / 116

页数：12

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