Synthesis and thermal and wetting properties of Tin/Silver alloy nanoparticles for low melting point lead-free solders

被引：110

作者：

Jiang, Hongjin

Moon, Kyoung-Sik

Hua, Fay

Wong, C. P. ^{[1
]}

机构：

[1] Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA

[2] Georgia Inst Technol, Sch Chem & Biochem, Atlanta, GA 30332 USA

[3] Intel Corp, Mat Technol Operat, Santa Clara, CA 95054 USA

来源：

CHEMISTRY OF MATERIALS | 2007年 / 19卷 / 18期

关键词：

D O I：

10.1021/cm0709976

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Tin/silver alloy nanoparticles with various sizes were synthesized via a low-temperature chemical reduction method, and their thermal properties were studied by differential scanning calorimetry. The particle size dependency of the melting temperature and the latent heat of fusion was observed. The melting point was achieved as low as 194 degrees C when the average diameter of the alloy nanoparticles was around 10 nm. The wetting test for as-prepared 64 nm (average diameter) SnAg alloy nanoparticle pastes on a Cu surface showed the typical Cu6Sn5 intermetallic compound (IMC) formation. These low melting point SnAg alloy nanoparticles could be used for low-temperature lead-free interconnect applications.

引用

页码：4482 / 4485

页数：4

共 18 条

[1] EVALUATION OF LEAD-FREE SOLDER JOINTS IN ELECTRONIC ASSEMBLIES [J].