Processing and characterization of high-conductance bismuth wire array composites

被引:38
作者
Huber, TE [1 ]
Graf, MJ
Foss, CA
Constant, P
机构
[1] Howard Univ, Laser Res Lab, Washington, DC 20059 USA
[2] Boston Coll, Dept Phys, Chestnut Hill, MA 02467 USA
[3] Georgetown Univ, Dept Chem, Washington, DC 20057 USA
基金
美国国家科学基金会;
关键词
The work of T.E.H. was supported by the Army Research Office through Grant No. DAA H04-95-1-0117 and by the National Science Foundation through Grant No. DMR-9632819. M.J.G. was supported in part through Research Corporation Grant No. RA0246. C.A.F.’s research was supported by the Division of Materials Research of the National Science Foundation through Grant No. DMR 9625151. We thank Prof. D. Farkas of Virginia Tech. for valuable discussions;
D O I
10.1557/JMR.2000.0262
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
We fabricated Bi nanowire array composites with wire diameters from 30 to 200 nm by high-pressure injection (HPI) of Bi melt into porous anodic alumina templates. The composites were dense, with Bi volume fraction in excess of 50%. The parallel Bi nanowires, whose length appeared to be limited only by the thickness of the host template (up to 55 mu m), terminated at both sides of the composite in the Bi bulk. The individual Bi nanowire crystal structure was rhombohedral, with the same lattice parameters as that of bulk Bi; the wires in the array were predominantly oriented with the trigonal axis along the wire length. Low contact resistance was achieved by bonding the composite to copper electrodes.
引用
收藏
页码:1816 / 1821
页数:6
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