Laser assisted particle removal 'dry' cleaning of critical surfaces

被引:15
作者
Allen, SD
Miller, AS
Lee, SJ
机构
[1] XONTECH INC,VAN NUYS,CA 91406
[2] NATL PINGTUNG TEACHERS COLL,DEPT MATH & SCI EDUC,PINGTUNG,TAIWAN
来源
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY | 1997年 / 49卷 / 02期
关键词
laser processing; silicon processing; surface contamination;
D O I
10.1016/S0921-5107(96)01884-3
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Laser assisted particle removal (LAPR) is a technique for removing minute particles from surfaces using an energy transfer medium condensed under and around the particles. The laser energy is absorbed in the energy transfer medium, either directly or via conduction from the substrate, explosively evaporating the condensed medium and propelling the particles off the substrate. The effect of the amount of energy transfer medium, water in this case, has been studied and a technique developed for monitoring the condensation and amount of water condensed on the substrate. (C) 1997 Elsevier Science S.A.
引用
收藏
页码:85 / 88
页数:4
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