Micromachined micropackaged filter banks

被引：13

作者：

Brown, AR ^{[1
]}

Rebeiz, GM ^{[1
]}

机构：

[1] Univ Michigan, Dept Elect Engn, Radiat Lab, Ann Arbor, MI 48109 USA

来源：

IEEE MICROWAVE AND GUIDED WAVE LETTERS | 1998年 / 8卷 / 04期

关键词：

filters; micromachining; packaging techniques;

D O I：

10.1109/75.663518

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A micromachined, micropackaged filter bank at X/Ku-band is presented. The filters are integrated on a silicon substrate, and the micropackaging provides high isolation between the adjacent filters in the overlapping frequency region. This technology allows for the low-cost integration of switched filter banks on the same substrate for satellite communication systems, base-stations, and wide-band radar applications.

引用

页码：158 / 160

页数：3