Simulation of an integrated PCM-wallboard system

被引：49

作者：

Kim, JS ^{[1
]}

Darkwa, K ^{[1
]}

机构：

[1] Nottingham Trent Univ, Sch Property & Construct, Div Bldg & Design, AEEEG, Nottingham NG1 4BU, England

来源：

INTERNATIONAL JOURNAL OF ENERGY RESEARCH | 2003年 / 27卷 / 03期

关键词：

phase change material; energy storage; heat transfer;

D O I：

10.1002/er.869

中图分类号：

TE [石油、天然气工业]; TK [能源与动力工程];

学科分类号：

0807 ; 0820 ;

摘要：

Heat transfer barriers and other practical difficulties do currently hamper the development and application of (phase change materials) PCM-wallboard systems. In this study thermal performance of randomly mixed PCM and laminated PCM-wallboard systems have been numerically evaluated and results compared. The laminated system displayed up to 50% increment in heat flux enhancement and about 18% increase in heat transfer rates. Consequently, the laminated PCM-wallboard system has greater potential for heating and cooling application in buildings than the randomly mixed system. Experimental validation and investigation into manufacturing techniques are however needed to establish the commercial viability. Copyright (C) 2002 John Wiley Sons, Ltd.

引用

页码：215 / 223

页数：9

共 12 条

[1]

Darkwa K, 1999, INT J ENERG RES, V23, P1205, DOI 10.1002/(SICI)1099-114X(199911)23:14<1205::AID-ER575>3.0.CO

[2]

2-H

[3]

Darkwa K, 2000, ARCHITECTURAL SCI RE, V43, P221

[4]

DARKWA K, 2001, P 36 INT EN CONV ENG, P201

[5]

FEUSTEL HE, 1997, LBL38320 LAUR BERK N

[6]

Jokisalo J, 1999, P IEA ANN 10 PCMS CH, P11

[7]

Kissock J. K., 1998, Proceedings of the International Solar Energy Conference. Solar Engineering 1998, P45

[8]

Minkowycz W.J., 1998, HDB NUMERICAL HEAT T

[9]

SAGARA K, 1998, P IEA ANN 10 PCMS CH, P37

[10]

STAZGER P, 1997, P 7 INT C THERM EN S

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