Tensile behavior of free-standing gold films. Part I. Coarse-grained films

被引：98

作者：

Emery, RD ^{[1
]}

Povirk, GL ^{[1
]}

机构：

[1] Yale Univ, Dept Mech Engn, New Haven, CT 06520 USA

来源：

ACTA MATERIALIA | 2003年 / 51卷 / 07期

基金：

美国国家科学基金会;

关键词：

thin films; tensile testing; Hall-Petch; grain boundary strengthening; annealing;

D O I：

10.1016/S1359-6454(03)00006-5

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The room temperature mechanical behavior of free-standing, coarse-grained gold films (grain size greater than 1.5 mum) was investigated by uniaxial tensile testing. Use of different deposition conditions resulted in films with a variety of microstructures. In addition, some of the free-standing films were also subjected to high temperature anneals to further alter their microstructures. With the exception of low ductility, the mechanical behavior of the films was generally consistent with what would be expected from large-scale gold specimens having similar grain size. (C) 2003 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.

引用

页码：2067 / 2078

页数：12

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