Modeling of waterjet guided laser grooving of silicon

Waterjet guided laser processing is an internationally patented technique based on guiding a laser inside a thin, high-speed waterjet. The process combines the advantages of laser processing with those of waterjet cutting and offers promise as a method for processing thin and heat sensitive materials with a high degree of precision. An improved understanding of the complex interaction between laser, waterjet, and workpiece is required to enable the process to achieve its potential. A model for waterjet guided laser grooving of silicon is presented that treats the energy input of the laser, the cooling effect of the waterjet, and the melting and removal of the silicon. The thermal process is represented in detail in the new method. The model is validated by comparisons of simulation and experimental results, and the simulation provides insight regarding the details of the interactions among laser, waterjet, and workpiece. (C) 2003 Elsevier Science Ltd. All rights reserved.