Study of interface effects in thermoelectric microrefrigerators

被引：38

作者：

Ju, YS ^{[1
]}

Ghoshal, U ^{[1
]}

机构：

[1] IBM Corp, Austin Res Lab, Austin, TX 78758 USA

来源：

JOURNAL OF APPLIED PHYSICS | 2000年 / 88卷 / 07期

关键词：

D O I：

10.1063/1.1289776

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Interface phenomena play a vital role in thermoelectric (TE) microrefrigerators. The present study employs a phenomenological model to examine the behavior of TE refrigerators as a function of thermal and electrical contact resistance, boundary Seebeck coefficient, and heat sink conductance. We modify the conventional definition of the figure of merit to capture the interface effects. A finite temperature drop across the interface between a metal electrode and a thermoelement is found to strongly influence the boundary Seebeck effect. Interface engineering can potentially improve the overall performance of TE microrefrigerators. (C) 2000 American Institute of Physics. [S0021-8979(00)08019-1].

引用

页码：4135 / 4139

页数：5

共 14 条

[1]

Anselm A., 1981, Introduction to Semiconductor Theory

[2]

Bartkowiak M, 1999, MATER RES SOC SYMP P, V545, P265

[3] Thermoelectric cooling and power generation [J].