Acid copper plating with insoluble anodes - a novel technology in PCB manufacturing

被引:6
作者
Barthelmes, J [1 ]
机构
[1] Atotech Germany, D-10553 Berlin, Germany
来源
TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING | 2000年 / 78卷 / 04期
关键词
D O I
10.1080/00202967.2000.11871325
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
The novel technique of plating printed circuit boards with insoluble anodes is explained The basic electrochemical equations of different electrolyte alternatives are shown and the advantages and disadvantages of these systems explained A general understanding of the the meaning of anode potentials, the interpretation of potential-current functions, the development of the ferrous ion concentration (in the Atotech electrolyte) with time and current density and the interaction of organic additives with the new substrate is discussed Combining insoluble anodes with pulse plating as state-of-the-art technology proves to be a most efficient tool for the production of current high end and future PCBs, including blind microvia boards of very difficult aspect ratios.
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收藏
页码:135 / 139
页数:5
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