Interaction between copper and gallium

被引:15
作者
Ancharov A.I. [1 ,2 ]
Grigoryeva T.F. [1 ]
Barinova A.P. [1 ]
Boldyrev V.V. [1 ,2 ]
机构
[1] Institute of Solid State Chemistry and Mechanochemistry, Siberian Branch, Russian Academy of Sciences, Novosibirsk 630128
[2] Novosibirsk State University, Novosibirsk 630090
关键词
74.72.-h;
D O I
10.1134/S0036029508060049
中图分类号
学科分类号
摘要
The interaction between solid copper and liquid gallium is considered, which is the main process during the setting of diffusion-solidifying solders. The dependences of the process rate and the size characteristics on the phase composition of the initial mixture are found. The intermetallic compound CuGa2 is shown to be the product of the interaction in all cases. © 2008 Pleiades Publishing, Ltd.
引用
收藏
页码:475 / 479
页数:4
相关论文
共 5 条
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[2]  
Tikhomirova O.I., Ruzinov L.P., Pikunov M.V., Marchukova I.D., Interdiffusion in the Gallium-Copper System, Fiz. Met. Metalloved., 29, pp. 796-802, (1970)
[3]  
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[4]  
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[5]  
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