Pulverization of waste printed circuit boards

被引：5

作者：

Takanori Hino

Daisuke Narahara

Ryuichi Agawa

Yasuhiro Tsugita

Minoru Nishida

Takao Araki

机构：

[1] Niihama National College of Technology,Department of Materials Science and Engineering

[2] Ehime University,Graduate Course of Materials Science and Engineering

[3] Sumitomo Metal Mining Co.,Department of Materials Science and Engineering

[4] Ehime University,undefined

来源：

Journal of Material Cycles and Waste Management | 2003年 / 5卷 / 2期

关键词：

Printed circuit board; Drop weight test; Pulverization mechanism;

D O I：

10.1007/s10163-003-0095-5

中图分类号：

学科分类号：

摘要：

A new pulverization method to reduce the volume of waste printed circuit boards is reported. About 50% of printed circuit boards with integrate circuits (ICs) could be pulverized by our method in one 20-min batch, but boards without ICs could not be pulverized. By repeating the process three times, about 95% of printed circuit boards with ICs could be made into a fine powder with particles less than 106 µm. A weight-drop test was also performed to examine the strength of the printed circuit boards and clarify the mechanism of pulverization. When a weight was dropped on the solder-welding side of the board ruptures occurred more easily than when the weight was dropped on the IC-mounted side. With a heavy weight, the IC was fractured more easily when the potential energy was low. Where the stress was concentrated, two types of rupture location were found on printed circuit boards with ICs. One was where the IC was connected to the printed circuit board. The other was where the surface had undulations. It also became clear that the fracture of printed circuit boards depends on the impacting weight rather than on the potential energy.

引用

页码：137 / 142

页数：5