INFLUENCE OF THERMAL-CONDUCTIVITY ON INTERFACE SHAPE DURING BRIDGMAN GROWTH

被引:34
作者
HUANG, CE
ELWELL, D
FEIGELSON, RS
机构
关键词
D O I
10.1016/0022-0248(83)90327-5
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
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页码:441 / 447
页数:7
相关论文
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