STUDY OF COPPER ALUMINA BONDING

被引：90

作者：

BERAUD, C ^{[1
]}

COURBIERE, M ^{[1
]}

ESNOUF, C ^{[1
]}

JUVE, D ^{[1
]}

TREHEUX, D ^{[1
]}

机构：

[1] ECOLE CENT LYON,MET LAB,F-69131 ECULLY,FRANCE

来源：

关键词：

D O I：

10.1007/BF00544543

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：4545 / 4554

页数：10

共 29 条

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[4] DIRECT BONDING OF METALS TO CERAMICS BY GAS-METAL EUTECTIC METHOD
BURGESS, JF
NEUGEBAUER, CA
FLANAGAN, G
[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1975, 122 (05) : 688 - 690
[5] COURBIERE M, 1986, THESIS ECL
[6] Courbiere M., 1987, HIGH TECH CERAMICS, P2599
[7] Dickson J. F., 1982, International Journal for Hybrid Microelectronics, V5, P103
[8] DUSHMAN S, 1962, SCI F VACUUM TECHNIQ
[9] ESNOUF C, 1986, J PHYS C SOLID STATE, V1, P18
[10] EUSTATHOPOULOS N, 1978, 7TH P INT STEELM DAY