INITIATION OF ELECTROLESS CU PLATING ON NONMETALLIC SURFACES

被引：18

作者：

HORKANS, J ^{[1
]}

SAMBUCETTI, C ^{[1
]}

MARKOVICH, V ^{[1
]}

机构：

[1] IBM CORP,DIV GEN TECHNOL,ENDICOTT,NY 13760

来源：

IBM JOURNAL OF RESEARCH AND DEVELOPMENT | 1984年 / 28卷 / 06期

关键词：

D O I：

10.1147/rd.286.0690

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

引用

页码：690 / 696

页数：7

共 24 条

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[5]

COHEN RL, 1976, PLAT SURF FINISH, V63, P52

[6]

GRUNWALD JJ, 1981, PLAT SURF FINISH, V68, P71

[7] A CYCLIC VOLTAMMETRIC STUDY OF PD-SN COLLOIDAL CATALYSTS FOR ELECTROLESS DEPOSITION [J].

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JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (02) :311-317

[8]

KAEBLE DH, 1969, J ADHESION, V1, P102

[9] RUTHERFORD SCATTERING STUDY OF CATALYST SYSTEMS FOR ELECTROLESS CU PLATING .1. SURFACE CHEMISTRY OF MIXED PD, SN COLLOIDS [J].

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JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1975, 122 (09) :1177-1185

[10]

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