ON THE PARASITIC CAPACITANCES OF MULTILEVEL PARALLEL METALLIZATION LINES

被引：19

作者：

TAYLOR, CD

ELKHOURI, GN

WADE, TE

机构：

来源：

IEEE TRANSACTIONS ON ELECTRON DEVICES | 1985年 / 32卷 / 11期

关键词：

D O I：

10.1109/T-ED.1985.22287

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：2408 / 2414

页数：7

共 15 条

[1] CORRECTION [J].

CHANG, WH .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1977, 25 (08) :712-712

[2] ANALYTICAL IC METAL-LINE CAPACITANCE FORMULAS [J].

CHANG, WH .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1976, 24 (09) :608-611

[3]

COTRELL PE, 1982, IEDM, P548

[4] ACCURACY OF FINITE-DIFFERENCE SOLUTIONS OF LAPLACES EQUATION [J].

DUNCAN, JW .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1967, MT15 (10) :575-&

[5]

Forsythe G.E., 1960, FINITE DIFFERENCE ME

[6] CALCULATION OF CAPACITANCE COEFFICIENTS FOR A SYSTEM OF IRREGULAR FINITE CONDUCTORS ON A DIELECTRIC SHEET [J].

PATEL, PD .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1971, MT19 (11) :862-&

[7]

RAMO S, 1965, FIELDS WAVES COMMUNI, P444

[8] ACCURATE METALLIZATION CAPACITANCES FOR INTEGRATED-CIRCUITS AND PACKAGES [J].

RUEHLI, AE ;

BRENNAN, PA .

IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1973, SC-8 (04) :289-290

[9] CAPACITANCE MODELS FOR INTEGRATED-CIRCUIT METALLIZATION WIRES [J].

RUEHLI, AE ;

BRENNAN, PA .

IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1975, 10 (06) :530-536

[10] SIMPLE FORMULAS FOR TWO-DIMENSIONAL AND 3-DIMENSIONAL CAPACITANCES [J].

SAKURAI, T ;

TAMARU, K .

IEEE TRANSACTIONS ON ELECTRON DEVICES, 1983, 30 (02) :183-185

← 1 2 →