THERMALLY OPTIMUM SPACING OF VERTICAL, NATURAL-CONVECTION COOLED, PARALLEL PLATES

被引:426
作者
BARCOHEN, A [1 ]
ROHSENOW, WM [1 ]
机构
[1] MIT,DEPT MECH ENGN,CAMBRIDGE,MA 02139
来源
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME | 1984年 / 106卷 / 01期
关键词
D O I
10.1115/1.3246622
中图分类号
O414.1 [热力学];
学科分类号
摘要
引用
收藏
页码:116 / 123
页数:8
相关论文
共 20 条
[1]   HEAT-TRANSFER IN ELECTRONIC SYSTEMS WITH EMPHASIS ON ASYMMETRIC HEATING [J].
AUNG, W .
BELL SYSTEM TECHNICAL JOURNAL, 1973, 52 (06) :907-925
[2]   DEVELOPING LAMINAR FREE CONVECTION BETWEEN VERTICAL FLAT PLATES WITH ASYMMETRIC HEATING [J].
AUNG, W ;
SERNAS, V ;
FLETCHER, LS .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 1972, 15 (11) :2293-&
[3]   FREE CONVECTION COOLING OF ELECTRONIC SYSTEMS [J].
AUNG, W ;
KESSLER, TJ ;
BEITIN, KI .
IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1973, PHP9 (02) :75-86
[5]  
BARCOHEN A, 1979, ASME, V101, P564
[6]  
BODOIA JR, 1964, ASME J HEAT TRANSFER, V84, P40
[7]   GENERAL EXPRESSION FOR CORRELATION OF RATES OF TRANSFER AND OTHER PHENOMENA [J].
CHURCHILL, SW ;
USAGI, R .
AICHE JOURNAL, 1972, 18 (06) :1121-+
[8]  
ELENBAAS W, 1942, PHYSICA, V9
[9]  
HORTON SF, 1981, THESIS MASSACHUSETTS
[10]  
KRAUS AD, 1962, COOLING ELECTRONIC E