ELECTROLESS COPPER PLATING IN THE PRESENCE OF EXCESS TRIETHANOL AMINE

被引：21

作者：

KONDO, K ^{[1
]}

ISHIKAWA, J ^{[1
]}

TAKENAKA, O ^{[1
]}

MATSUBARA, T ^{[1
]}

IRIE, M ^{[1
]}

机构：

[1] KYUSHU UNIV,INST ADV MAT STUDY,KASUGA,FUKUOKA 816,JAPAN

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1990年 / 137卷 / 06期

关键词：

D O I：

10.1149/1.2086819

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

[No abstract available]

引用

页码：1859 / 1860

页数：2

共 10 条

[1] SPECTROPHOTOMETRIC INVESTIGATION OF THE COPPER(II) ION TRIETHANOLAMINE COMPLEX [J].

BOLLING, JM ;

HALL, JL .

JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 1953, 75 (16) :3953-3955

[2] KINETICS OF ELECTROLESS COPPER PLATING .4. EMPIRICAL RATE LAW FOR H2CO-EDTA BATHS [J].

DONAHUE, FM ;

WONG, KLM ;

BHALLA, R .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1980, 127 (11) :2340-2342

[3]

FIERO GW, 1939, J AM PHARM ASSOC, V28, P1036

[4]

HONMA H, 1984, MET FINISH, V82, P47

[5] A TEM STUDY OF THE EFFECT OF ACCELERATORS ON PD-SN COLLOIDAL CATALYSTS AND ON THE INITIATION OF ELECTROLESS CU DEPOSITION ON EPOXY [J].

HORKANS, J ;

KIM, J ;

MCGRATH, C ;

ROMANKIW, LT .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1987, 134 (02) :300-304

[6]

NOZAKI R, 1963, NIHONKAGAKUZASSHI, V84, P10

[7] LIGAND EFFECTS IN ELECTROLESS COPPER DEPOSITION [J].

PAUNOVIC, M .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1977, 124 (03) :349-354

[8] STRUCTURE OF COMPLEXED COPPER SPECIES IN ELECTROLESS COPPER PLATING SOLUTIONS [J].

SCHOENBERG, LN .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1971, 118 (10) :1571-+

[9]

SHIPPEY FL, 1977, PLATING, V60, P43

[10] ROLE OF POTASSIUM FERROCYANIDE IN ELECTROLESS COPPER BATHS [J].

VELEVA, R .

SURFACE & COATINGS TECHNOLOGY, 1986, 29 (02) :87-93

← 1 →