High performance forced air cooling scheme employing microchannel heat exchangers

被引:113
作者
Kleiner, MB
Kuhn, SA
Haberger, K
机构
[1] SIEMENS AG, CORP RES & DEV, W-8000 MUNICH, GERMANY
[2] FRAUNHOFER INST SOLID STATE TECHNOL, MUNICH, GERMANY
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A | 1995年 / 18卷 / 04期
关键词
heat sink; heat removal; heat exchanger; air cooling; microchannel; micro-channel; narrow channel; thermal resistance;
D O I
10.1109/95.477466
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this paper, a high performance forced air cooling scheme is theoretically and experimentally investigated which employs microchannel parallel plate-fin heat sinks and tubes to deliver the air to and optionally from the heat sink, The performance of the cooling system is modeled in terms of thermal resistance, pressure drop, and pumping power, Optimizations are performed and design trade-offs discussed. Tubes are observed to have a significant impact on optimum heat sink design as well as operating point, Sample heat sinks with lateral dimensions of 5 x 5 cm(2) and fin lengths of 1.5 and 2.5 cm were fabricated from copper and aluminum foils using a simple assembly process, Fin thicknesses and channel widths of the heat sinks are on the order of 200 and 500 mu m, respectively, Thermal resistances as low as 0.2 K/W are measured, Results of the present study are compared to prior works dealing with direct air cooling, The thermal performances achievable using the investigated cooling approach are superior to those attainable using open air cooled heat sinks as well as those employing silicon microcoolers.
引用
收藏
页码:795 / 804
页数:10
相关论文
共 18 条
[1]  
AZAR K, 1992, P 8 ANN IEEE SEM THE, P12
[2]   EVALUATION OF A 3-DIMENSIONAL MEMORY CUBE SYSTEM [J].
BERTIN, CL ;
PERLMAN, DJ ;
SHANKEN, SN .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (08) :1006-1011
[3]   NARROW CHANNEL FORCED AIR HEAT SINK [J].
GOLDBERG, N .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1984, 7 (01) :154-159
[4]  
GROMOLL B, 1994, P 10 IEEE SEM THERM, P53
[5]  
Hayashi Y., 1991, International Electron Devices Meeting 1991. Technical Digest (Cat. No.91CH3075-9), P657, DOI 10.1109/IEDM.1991.235336
[6]  
HILBERT C, 1990, P 6 IEEE SEM THERM T, P108
[7]  
Kays W., 1964, COMPACT HEAT EXCHANG
[8]  
KITAJO S, 1992, P IEEE SEMITHERM S, P119
[9]   OPTIMAL THERMAL DESIGN OF AIR COOLED FORCED-CONVECTION FINNED HEAT SINKS - EXPERIMENTAL-VERIFICATION [J].
KNIGHT, RW ;
GOODLING, JS ;
GROSS, BE .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1992, 15 (05) :754-760
[10]   HEAT SINK OPTIMIZATION WITH APPLICATION TO MICROCHANNELS [J].
KNIGHT, RW ;
HALL, DJ ;
GOODLING, JS ;
JAEGER, RC .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1992, 15 (05) :832-842