ADHESION ENHANCEMENT OF NI FILMS ON POLYIMIDE USING ION PROCESSING .1. SI-28+ IMPLANTATION

被引：19

作者：

GALUSKA, AA

机构：

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1990年 / 8卷 / 03期

关键词：

D O I：

10.1116/1.585047

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：470 / 481

页数：12

共 29 条

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[2]

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[4] ALUMINUM POLYIMIDE INTERFACE FORMATION - AN X-RAY PHOTOELECTRON-SPECTROSCOPY STUDY OF SELECTIVE CHEMICAL BONDING [J].

ATANASOSKA, L ;

ANDERSON, SG ;

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LIN, Z ;

WEAVER, JH .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1987, 5 (06) :3325-3333

[5] ION-BOMBARDMENT AND TITANIUM FILM GROWTH ON POLYIMIDE [J].

BODO, P ;

SUNDGREN, JE .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1988, 6 (04) :2396-2402

[6] METAL-POLYMER INTERFACES - ADHESION AND X-RAY PHOTOEMISSION-STUDIES [J].

BURKSTRAND, JM .

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[7]

BURNETT PJ, 1987, THIN SOLID FILMS, V154, P43

[8]

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[9]

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[10]

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