THE APPLICATION OF A POLYPYRROLE PRECOAT FOR THE METALLIZATION OF PRINTED-CIRCUIT BOARDS

被引：26

作者：

GOTTESFELD, S ^{[1
]}

URIBE, FA ^{[1
]}

ARMES, SP ^{[1
]}

机构：

[1] UNIV SUSSEX,SCH CHEM & MOLEC SCI,BRIGHTON BN1 9QG,E SUSSEX,ENGLAND

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1992年 / 139卷 / 01期

关键词：

D O I：

10.1149/1.2069210

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

We describe a printed circuit board metallization process starting with the formation of a precoat of polypyrrole (PPY) on the board, followed by the direct electrodeposition of copper onto the polypyrrole-coated substrate. The polypyrrole film is applied to the insulating substrate by a single chemical polymerization step from an aqueous solution. The sheet resistance of the polypyrrole precoat is typically of the order of a few hundred OMEGA/square which is a sufficiently low resistance to enable direct metal electrodeposition onto the PPY-coated substrate.

引用

页码：L14 / L15

页数：2

共 8 条

[1]

Coombs Jr CF, 1988, PRINTED CIRCUIT HDB

[2]

Gregory R. V., 1989, SYNTHETIC MET, V28, P823, DOI DOI 10.1016/0379-6779(89)90610-3

[3] METALLIZATION OF PRINTED-CIRCUIT BOARDS USING CONDUCTING POLYANILINE [J].

HUANG, WS ;

ANGELOPOULOS, M ;

WHITE, JR ;

PARK, JM .

MOLECULAR CRYSTALS AND LIQUID CRYSTALS, 1990, 189 :227-235

[4]

KUHN HH, 1989, Patent No. 4803096

[5] CHEMICAL SYNTHESIS OF HIGHLY ELECTRICALLY CONDUCTIVE POLYPYRROLE [J].

MACHIDA, S ;

MIYATA, S ;

TECHAGUMPUCH, A .

SYNTHETIC METALS, 1989, 31 (03) :311-318

[6]

NICOLAU YF, 1991, SYNTHETIC MET, V41, P1491

[7]

1989, Patent No. 204

[8]

1990, EL SOC EXT ABSTR, V90, P66

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