TA/POLYIMIDE ADHESION DURABILITY

被引：4

作者：

CALLEGARI, A

FURMAN, B

GRAHAM, T

CLEARFIELD, H

PRICE, W

PURUSHOTHAMAN, S

机构：

[1] IBM T.J. Watson Research center, Yorktown Heights, NY 10598

来源：

MICROELECTRONIC ENGINEERING | 1992年 / 19卷 / 1-4期

关键词：

D O I：

10.1016/0167-9317(92)90500-Q

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The adhesion durability of Ta to plasma-modified polyimide surfaces has been investigated under thermal exposure. The failure mechanism was correlated with Auger analysis. Resistance to oxidation at the Ta/polyimide interface was found necessary to obtain a durable metal/polymer adhesion strength.

引用

页码：575 / 578

页数：4

共 4 条

[1] Furman, Purushothaman, Castellani, Renick, Neugroshl, Metallization of Polymers, ACS Symposium series, 297, (1990)
[2] Holloway, Frier, Tantalum as a diffusion barrier between copper and silicon, Appl. Phys. Lett., 57, (1990)
[3] Pappas, Cuomo, Sachdev, Studies of adhesion of metal films to polyimide, Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, 9 A, (1991)
[4] Clearfield, Furman, Sheth, Bailey, Purushothaman, Water transport across modified polyimide surfaces, Proceedings of Adhesion Soc. Symposium, (1992)

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