HYDROGEN EMBRITTLEMENT OF ELECTROLESS COPPER-DEPOSITS

被引:63
作者
OKINAKA, Y [1 ]
NAKAHARA, S [1 ]
机构
[1] BELL TEL LABS INC,MURRAY HILL,NJ 07974
关键词
D O I
10.1149/1.2132858
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
引用
收藏
页码:475 / 478
页数:4
相关论文
共 18 条
  • [1] ALBERT ML, 1964, Z NATURFORSCHUNG A, V19, P1120
  • [2] EFFECTS OF STABILIZING ADDITIVES ON MICROSTRUCTURE AND PROPERTIES OF ELECTROLESS COPPER-DEPOSITS
    AYCOCK, TL
    HUIE, NC
    KRAUSS, G
    [J]. METALLURGICAL TRANSACTIONS, 1974, 5 (05): : 1215 - 1223
  • [3] Grunwald J. J., 1971, PLATING, V58, P1004
  • [4] GRUNWALD JJ, 1973, 4TH P PLAT EL IND S, P13
  • [5] HIROHATA H, 1970, J MET FINISH SOC JPN, V21, P485
  • [6] Lukes R.M, 1964, PLATING, V51, P1066
  • [7] NAKAHARA S, 1975, PROPERTIES ELECTRODE, pCH3
  • [8] NAKAHARA S, TO BE PUBLISHED
  • [9] OKINAKA Y, UNPUBLISHED RESULTS
  • [10] OKINAKA Y, 1969, OCT EL SOC M DETR