TECHNIQUES FOR FABRICATION OF WAFER SCALE INTERCONNECTIONS IN MULTICHIP PACKAGES

被引：11

作者：

MCDONALD, JF

LIN, HT

GREUB, HJ

PHILHOWER, RA

DABRAL, S

机构：

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1989年 / 12卷 / 02期

关键词：

D O I：

10.1109/33.31424

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：195 / 205

页数：11

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[4]

DOHMOTO H, 1986, P INT WORKSHOP ICBT, P171

[5]

DONLAN BJ, 1985, WAFER SCALE INTEGRAT, P31

[6]

ECONOMOU N, 1987, 1987 P SPIE, V773, P201

[7]

Greub H., 1986, 1986 Proceedings Third International IEEE VLSI Multilevel Interconnection Conference (Cat. No. 86CH2337-4), P250

[8]

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[9]

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