PROPANE - HYDROGEN MORIE OF GAAS

被引:2
作者
LAW, VJ
JONES, GAC
TEWORDT, M
机构
[1] Cavendish Lab., Cambridge Univ.
关键词
D O I
10.1088/0268-1242/5/9/015
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Metal-organic reactive ion etching of GaAs and related III-V semiconductor materials, using an RF plasma containing a mixture of C3H 8:H2 is described. The kinetic properties of the process are compared with CH4:H2 and C2H 6:H2 etching of GaAs. Results indicate that when the H2 flow dependency is optimised, C3H8:H 2 produces between 20-38 nm min-1 GaAs etch rates, with a reactivity of 2.5 greater than CH4:H2 RF plasmas.
引用
收藏
页码:1001 / 1003
页数:3
相关论文
共 11 条
[1]  
Niggebrugge U, Klug M, Garus G, (1985)
[2]  
Cheung R, Thoms S, Beaumont SP, Doughty G, Law V, Wilkinson CDW, Electron. Lett., 23, 16, (1987)
[3]  
Law VJ, Jones GAC, Peacock DC, Ritchie DA, Frost JEF, Selective metalorganic reactive ion etching of molecular-beam epitaxy GaAs/AlxGa1−xAs, Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 7, 6, (1989)
[4]  
Matsui T, Sugimoto H, Ohishi T, Ogata H, Electron. Lett., 24, 13, (1988)
[5]  
Pearton SJ, Hobson WS, J. Appl. Phys., 66, 10, (1989)
[6]  
Law VJ, Jones GAC, Tewordt M, Royal H, (1990)
[7]  
Law VJ, Jones GAC, Semicond. Sci. Technol., 4, 9, (1989)
[8]  
Law VJ, Jones GAC, Patel NK, Tewordt M, 11, (1990)
[9]  
Weast RC, (1979)
[10]  
Long LH, Sackman JF, Trans. Farad. Soc., 54, (1958)