FUNGAL ADHESION

This paper reviews the processes involved in fungal attachment: initial passive attachment which is reversible (impaction, chemotaxis, entrapment, spore appendage mediated attachment); active attachment resulting from a thigmotropic response and leading to the production and release of extracellular adhesive; spore differentiation; germination with germ-tubes enveloped by a hyphal sheath; development of appressoria; and, finally penetration of the substratum/host. The chemical composition and origin of fungal adhesives is discussed and compared with other micro-organisms. Methods to determine the strength of attachment of fungal propagules to surfaces are reviewed and factors affecting fungal adhesion considered. The relevance of spore attachment in biotechnology, biodeterioration of materials, plant and animal pathology are stressed. Future areas of research are highlighted, especially the mechanism for transmitting a signal that the spore has made contact with the surface, resulting in the production and release of adhesive.