CORROSION-RESISTANCE OF AL-PD-SI CONDUCTOR

被引:7
作者
KOUBUCHI, Y [1 ]
ONUKI, J [1 ]
机构
[1] HITACHI LTD,HITACHI RES LAB,HITACHI,IBARAKI 31912,JAPAN
关键词
D O I
10.1109/16.108187
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
An Al-Pd-Si alloy conductor was developed which has higher corrosion resistance than Al-Si conductor after resin molding. A palladium oxide-rich (PdO-rich) area was formed by annealing in the surface oxide film on the Al-Pd-Si alloy conductors. It was considered responsible for the increased corrosion resistance of Al-Pd-Si with over 0.3 wt % Pd. © 1990 IEEE
引用
收藏
页码:1259 / 1263
页数:5
相关论文
共 18 条
[1]  
ENGEL PR, 1983, 33RD P EL COMP C, P245
[2]   CORROSION TEST FOR METALLIZATION FOR PLASTIC-ENCAPSULATED ICS [J].
IWATA, S ;
ISHIZAKA, A ;
YAMAMOTO, H .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (01) :110-114
[3]   FUNDAMENTAL FACTORS GOVERNING IMPROVED PERFORMANCE OF AL-SI/TI MULTILAYER METALLIZATION FOR VERY LARGE-SCALE INTEGRATION [J].
JOSHI, A ;
HU, HS ;
YANEY, DL ;
GARDNER, D ;
SARASWAT, K .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1989, 7 (03) :1497-1503
[4]  
KIN KS, 1974, ANAL CHEM, V46, P197
[5]  
KOUBUCHI Y, 1990, IEEE T ELECTRON DEV, V437, P947
[6]  
LOWSON RT, 1978, AUST J CHEM, P943
[7]   INVESTIGATION OF THE MOLECULAR PROCESSES CONTROLLING CORROSION FAILURE MECHANISMS IN PLASTIC ENCAPSULATED SEMICONDUCTOR-DEVICES [J].
LUM, RM ;
FEINSTEIN, LG .
MICROELECTRONICS AND RELIABILITY, 1981, 21 (01) :15-31
[8]  
MCGEARY RK, 1953, S ZR ZR ALLOYS, P168
[9]  
NOMURA S, 1964, B JAPAN I METALS, V3, P116
[10]  
NOMURA S, 1964, B JAPAN I METALS, V3, P170