EFFECT OF A SILICON SINTERING ADDITIVE ON SOLID-STATE BONDING OF SIC TO NB

被引:14
作者
NAKA, M
SAITO, T
OKAMOTO, I
机构
[1] Welding Research Institute of Osaka University, Osaka, 567, 11-1 Mihogaoka, Ibaraki
关键词
D O I
10.1007/BF00543633
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Pressureless-sintered (PLS) SiC was joined to Nb by solid state bonding in a vacuum. The joining strength of the PLS SiC/Nb joint increases to the saturated value of 108 MPa with increasing joining pressure at a joining condition of 1673 K and 7.2 ks. This saturated value of PLS SiC/Nb joint is higher than that of the reaction sintered (RS) SiC/Nb joint. The strength of SiC itself affects the strength of the SiC/Nb joint. The high stability of the intermediate phase Nb5Si3 in the interface at elevated temperature leads to the high heat resistance of the joint. The thickness of the intermediate phase Nb5Si3 in the PLS SiC/Nb system is lower than that of the RS SiC/Nb system at a constant joining time, although the activation energy, 452 kJ mol-1, of growth for the phase in the PLS SiC/Nb system is almost the same as the RS SiC/Nb system, 456 kJ mol-1. The rate constant of the growth for the phase in the PLS SiC/Nb system is lower than that in the RS SiC/Nb system. The excess silicon in RS SiC promotes the formation of the Nb5Si3 phase at the interface between SiC and Nb.
引用
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页码:1983 / 1987
页数:5
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