DEVELOPMENT OF NOVEL ARCHITECTURE AND ASSEMBLY TECHNIQUES FOR A DETECTOR UNIT FOR A SILICON MICRO-VERTEX DETECTOR USING THE FLIP-CHIP BONDING METHOD

被引：4

作者：

SAITOH, Y

YAMANAKA, J

SUZUKI, H

MIYAHARA, S

KAMIYA, M

KADOI, K

MASUDA, T

MAEMURA, K

INOUE, M

SUZUKI, A

TAKEUCHI, H

MANDAI, M

KANAZAWA, H

HIGASHI, Y

IKEDA, H

KOIKE, S

MATSUDA, T

OZAKI, H

TANAKA, M

TSUBOYAMA, T

AVRILLON, S

OKUNO, S

HABA, J

HANAI, H

MORI, S

YUSA, K

机构：

[1] KEK,NATL LAB HIGH ENERGY PHYS,TSUKUBA,JAPAN

[2] OSAKA UNIV,DEPT PHYS,OSAKA,JAPAN

[3] UNIV TSUKUBA,INST APPL PHYS,TSUKUBA,IBARAKI 30031,JAPAN

来源：

IEEE TRANSACTIONS ON NUCLEAR SCIENCE | 1993年 / 40卷 / 04期

关键词：

D O I：

10.1109/23.256614

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We built full-size models of a detector unit for a silicon micro-vertex detector for the KEK B factory. The model consists of four dummy double-sided, double-metal silicon micro-strip detectors and two silicon end boards with dummy readout VLSIs mounted on both sides. In this trial the Flip-Chip Bonding (FCB) method, using an anisotropic conductive film, is applied to both sides of the detector unit to bond 640 strips at a pitch of 50 gm. The structure using the FCB method successfully provides a new architecture for the detector unit of a vertex detector.

引用

页码：552 / 556

页数：5