THE EXCESS CAPACITANCE OF A MICROSTRIP VIA IN A DIELECTRIC SUBSTRATE

被引：21

作者：

WANG, TY

MAUTZ, JR

HARRINGTON, RF

机构：

[1] Department of Electrical and Computer Engineering, Syracuse University, Syracuse

来源：

IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS | 1990年 / 9卷 / 01期

关键词：

D O I：

10.1109/43.45856

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

The equivalent circuit of a via which connects two semi-infinitely long microstrip transmission lines imbedded in a dielectric medium above a ground plane is considered. The T-type equivalent circuit consists of an excess capacitance and an excess inductance. The excess inductance of the via is the same as the one computed in the case of free space (without a substrate). The excess capacitance of the via is computed quasi-statically by the method of moments and the image method from the integral equations. It converges rapidly as the number of image terms is increased. Parametric plots of the excess capacitance of the via are given for reference. © 1990 IEEE

引用

页码：48 / 56

页数：9

共 12 条

[1] THE EQUIVALENT RADIUS OF A NARROW CONDUCTING STRIP [J].