SOLID-STATE INTERMETALLIC COMPOUND GROWTH BETWEEN COPPER AND HIGH-TEMPERATURE, TIN-RICH SOLDERS .2. MODELING

被引：27

作者：

ERICKSON, KL ^{[1
]}

HOPKINS, PL ^{[1
]}

VIANCO, PT ^{[1
]}

机构：

[1] SANDIA NATL LABS,CTR SOLDER SCI & TECHNOL,ALBUQUERQUE,NM 87185

来源：

JOURNAL OF ELECTRONIC MATERIALS | 1994年 / 23卷 / 08期

关键词：

INTERFACIAL DIFFUSION; INTERMETALLIC GROWTH; SOLDER;

D O I：

10.1007/BF02651366

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The solder/base metal interfacial chemistry characterizing solder joints impacts the manufacturability and reliability of electronic components. A model was developed to predict the long-term diffusion-controlled growth of interfacial intermetallic compound layers using short-term experimental data. The model included terms for both constant and variable diffusion coefficients. Application of the model was demonstrated using parameter values for 100Sn/Cu system and comparing calculated layer thicknesses with the experimentally observed values. The early time data for the 100Sn/Cu system that were used to predict growth at longer times were characterized using a variable diffusion coefficient that was an empirical function of layer thickness.

引用

页码：729 / 734

页数：6