CONVECTION HEAT-TRANSFER IN ELECTRONIC EQUIPMENT COOLING

被引：367

作者：

INCROPERA, FP

机构：

来源：

JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME | 1988年 / 110卷 / 4B期

关键词：

D O I：

10.1115/1.3250613

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

引用

页码：1097 / 1111

页数：15

共 149 条

[1]

AAKALU NG, 1973, Patent No. 3741292

[2] LAMINAR MIXED CONVECTION IN A SHROUDED FIN ARRAY [J].

ACHARYA, S ;

PATANKAR, SV .

JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 1981, 103 (03) :559-565

[3]

AIHARA T, 1987, MAR INT S COOL TECHN

[4]

[Anonymous], 1973, REP I HIGH SPEED MEC

[5] COOLING COMPONENTS WITH BOILING HALOCARBONS [J].

ARMSTRONG, RJ .

IEEE TRANSACTIONS ON PARTS MATERIALS AND PACKAGING, 1967, PMP3 (04) :135-+

[6]

ARVIZU DE, 1982, IEEE CH17814820133 P

[7]

ASHIWAKE N, 1983, HEAT TRANSFER ELECT, V28, P35

AUNG, W ;

WORKU, G .

JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 1986, 108 (02) :485-488

AUNG, W ;

SERNAS, V ;

FLETCHER, LS .

AUNG, W ;

WORKU, G .

JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 1986, 108 (02) :299-304