CONVECTION HEAT-TRANSFER IN ELECTRONIC EQUIPMENT COOLING

被引:367
作者
INCROPERA, FP
机构
来源
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME | 1988年 / 110卷 / 4B期
关键词
D O I
10.1115/1.3250613
中图分类号
O414.1 [热力学];
学科分类号
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页码:1097 / 1111
页数:15
相关论文
共 149 条
[11]   NATURAL-CONVECTION IN OPEN-ENDED INCLINED CHANNELS [J].
AZEVEDO, LFA ;
SPARROW, EM .
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 1985, 107 (04) :893-901
[12]   LIQUID IMMERSION COOLING OF SMALL ELECTRONIC DEVICES [J].
BAKER, E .
MICROELECTRONICS AND RELIABILITY, 1973, 12 (02) :163-173
[13]   LIQUID COOLING OF MICROELECTRONIC DEVICES BY FREE AND FORCED CONVECTION [J].
BAKER, E .
MICROELECTRONICS AND RELIABILITY, 1972, 11 (02) :213-&
[14]   THERMALLY OPTIMUM SPACING OF VERTICAL, NATURAL-CONVECTION COOLED, PARALLEL PLATES [J].
BARCOHEN, A ;
ROHSENOW, WM .
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 1984, 106 (01) :116-123
[15]  
BARCOHEN A, 1986, ASME, V57, P83
[16]   CHARACTERISTICS OF NUCLEATE POOL BOILING FROM POROUS METALLIC COATINGS [J].
BERGLES, AE ;
CHYU, MC .
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 1982, 104 (02) :279-285
[17]  
BIEBER CR, 1986, ASME86WAHT68 PAP
[18]  
BIRNBRIER H, 1981, HEAT TRANSFER ELECTR, V20, P19
[19]  
BISKEBORN R, 1984, 4TH ANN INT EL PACK, P468
[20]  
Bodoia J.R., 1962, ASME J HEAT TRANSF, V84, P40, DOI [10.1115/1.3684288, DOI 10.1115/1.3684288]