CONVECTION HEAT-TRANSFER IN ELECTRONIC EQUIPMENT COOLING

被引：367

作者：

INCROPERA, FP

机构：

来源：

JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME | 1988年 / 110卷 / 4B期

关键词：

D O I：

10.1115/1.3250613

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

引用

页码：1097 / 1111

页数：15

共 149 条

[71]

LIU KV, 1987, MAR P INT S COOL EL, P486

[72]

MA CF, 1983, HEAT TRANSFER ELECTR, V28, P5

[73] THERMAL MANAGEMENT IN SEMICONDUCTOR-DEVICE PACKAGING [J].

MAHALINGAM, M .

[74]

MAHALINGHAM M, 1987, MAR P INT S COOL TEC, P608

[75]

MARK MM, 1958, IRE T ANE, V5, P47

MARTO, PJ ;

LEPERE, VJ .

JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 1982, 104 (02) :292-299

MAUGHAN, JR ;

INCROPERA, FP .

[78]

Megerlin F. E., 1971, Proceedings of the national aerospace electronics conference 1971, P254

[79]

MILANEZ LF, 1986, 8TH P INT HEAT TRANS, V3, P1347

[80]

MIYAMOTO M, 1986, 8TH P INT HEAT TRANS, V4, P1593